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 SEMICONDUCTOR
TECHNICAL DATA
General Description
KHB8D8N25P/F/F2
N CHANNEL MOS FIELD EFFECT TRANSISTOR
KHB8D8N25P
A O C F E G B Q I K M L J D N N H P
DIM MILLIMETERS _ 9.9 + 0.2 A B C D E F G H I J K L M N O
1 2 3
This planar stripe MOSFET has better characteristics, such as fast switching time, low on resistance, low gate charge and excellent avalanche characteristics. It is mainly suitable for DC/DC Converters and switching mode power supplies.
FEATURES
VDSS= 250V, ID= 8.8A Drain-Source ON Resistance : RDS(ON)=450m @VGS = 10V Qg(typ.) = 29.5nC
15.95 MAX 1.3+0.1/-0.05 _ 0.8 + 0.1 _ 3.6 + 0.2 _ 2.8 + 0.1 3.7 0.5+0.1/-0.05 1.5 _ 13.08 + 0.3 1.46 _ 1.4 + 0.1 _ 1.27 + 0.1 _ 2.54 + 0.2 _ 0.2 4.5 + _ 2.4 + 0.2 _ 9.2 + 0.2
1. GATE 2. DRAIN 3. SOURCE
P Q
MAXIMUM RATING (Ta=25
CHARACTERISTIC
)
RATING SYMBOL KHB8D8N25F UNIT KHB8D8N25P KHB8D8N25F2 250 30 8.8 35.2 285 7.4 5.5 74 PD 0.59 Tj Tstg 150 -55 150 0.3 W/ 38 8.8* 35.2* mJ
D K
TO-220AB
KHB8D8N25F
A F C
Drain-Source Voltage Gate-Source Voltage Drain Current @TC=25 Pulsed (Note1) Single Pulsed Avalanche Energy (Note 2) Repetitive Avalanche Energy (Note 1) Peak Diode Recovery dv/dt (Note 3) Drain Power Dissipation Ta=25 Derate above 25
VDSS VGSS ID IDP EAS EAR dv/dt
V V A
O
B
E G
DIM
MILLIMETERS
L
M J
R
mJ V/ns
Q 1
N
N
H
2
3
A B C D E F G H J K L M N O Q R
_ 10.16 + 0.2 _ 15.87 + 0.2 _ 2.54 + 0.2 _ 0.8 + 0.1 _ 3.18 + 0.1 _ 3.3 + 0.1 _ 0.2 12.57 + _ 0.5 + 0.1 13.0 MAX _ 3.23 + 0.1 1.47 MAX 1.47 MAX _ 2.54 + 0.2 _ 6.68 + 0.2 _ 4.7 + 0.2 _ 2.76 + 0.2
W
1. GATE 2. DRAIN 3. SOURCE
Maximum Junction Temperature Storage Temperature Range Thermal Characteristics Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-toAmbient
TO-220IS (1)
KHB8D8N25F2
A C F
RthJC RthJA
1.69 62.5
3.29 62.5
/W /W
S E
P
DIM
MILLIMETERS
* : Drain current limited by maximum junction temperature.
K L L R
PIN CONNECTION
D
D
M D J
N
N
H
G
1
2
3
A B C D E F G H J K L M N P Q R S
_ 10.0 + 0.3 _ 15.0 + 0.3 _ 2.70 + 0.3 0.76+0.09/-0.05 _ 3.2 +0.2 _ 3.0 + 0.3 _ 12.0 + 0.3 0.5+0.1/-0.05 _ 13.6 + 0.5 _ 3.7 + 0.2 1.2+0.25/-0.1 1.5+0.25/-0.1 _ 2.54 +0.1 _ 6.8 + 0.1 _ 4.5 + 0.2 _ 2.6 + 0.2 0.5 Typ
Q
G
B
1. GATE 2. DRAIN 3. SOURCE
S
TO-220IS
2007. 5. 10
Revision No : 0
1/7
KHB8D8N25P/F/F2
ELECTRICAL CHARACTERISTICS (Ta=25
CHARACTERISTIC
)
TEST CONDITION MIN. TYP. MAX. UNIT
SYMBOL
Static
Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Gate Threshold Voltage Drain Cut-off Current Gate Leakage Current Drain-Source ON Resistance Forward Transconductance BVDSS BVDSS/ Tj Vth IDSS IGSS RDS(ON) gFS ID=250 A, VGS=0V ID=250 A, Referenced to 25 VDS=VGS, ID=250 A VDS=250V, VGS=0V, VGS= 30V, VDS=0V VGS=10V, ID=4.4A VDS=40V, ID=4.4A (Note4) 250 2.0 0.27 360 7.6 4.0 10 100 450 V V/ V A nA m S
Dynamic
Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-on Delay time Turn-on Rise time Turn-off Delay time Turn-off Fall time Input Capacitance Output Capacitance Reverse Transfer Capacitance Source-Drain Diode Ratings Continuous Source Current Pulsed Source Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge IS VGSNote 1) Repetivity rating : Pulse width limited by junction temperature. Note 2) L = 5.9mH, IS=8.8A, VDD=50V, RG = 25 , Starting Tj = 25 . Note 3) IS 8.8A, dI/dt 300A/ , VDD 300 BVDSS, Starting Tj = 25 . 2%. Note 4) Pulse Test : Pulse width , Duty Cycle
Note 5) Essentially independent of operating temperature.
2007. 5. 10
Revision No : 0
2/7
KHB8D8N25P/F/F2
Fig1. ID - VDS
VGS TOP : 15.0 V 10.0 V 8.0 V 7.0 V 101 6.5 V 6.0 V 5.5 V Bottom : 5.0 V
Fig2. ID - VGS
VDS = 40V 250s Pulse Test
Drain Current ID (A)
Drain Current ID (A)
101
150 C
100
100
25 C
-55 C
10-1 10-1
100
101
10-1 2
4
6
8
10
Drain - Source Voltage VDS (V)
Gate - Source Voltage VGS (V)
Fig3. BVDSS - Tj
Normalized Breakdown Voltage BVDSS (V)
1.2
VGS = 0V IDS = 250A
Fig4. RDS(ON) - ID
2.5
On - Resistance RDS(ON) ()
2.0
1.1
1.5
VGS = 10V
1.0
1.0
0.9
0.5
VGS = 20V
0.8 -100
0.0 -50 0 50 100 150 0 6 12 18 24 30
Junction Temperature Tj ( C )
Drain Current ID (A)
Fig5. IS - VSD
3.0
VGS = 10V 250s Pulse Test VGS =10V ID = 8.8A
Fig6. RDS(ON) - Tj
Reverse Drain Current IS (A)
101
Normalized On Resistance
0.8 1.0 1.2 1.4 1.6
2.5 2.0 1.5 1.0 0.5
10
0
150 C
25 C
10-1 0.2
0.4
0.6
0.0 -100
-50
0
50
100
150
Source - Drain Voltage VSD (V)
Junction Temperture Tj ( C )
2007. 5. 10
Revision No : 0
3/7
KHB8D8N25P/F/F2
Fig7. C - VDS
3500 3000
Ciss
Fig8. Qg- VGS
Gate - Source Voltage VGS (V)
Frequency =1MHz
12 I =8.8A D 10 8 6 4 2 0 0 10 20 30 40
VDS = 50V VDS = 125V VDS = 200V
Capacitance (pF)
2500 2000 1500 1000 500 0 10-1 100 101
Coss Crss
Drain - Source Voltage VDS (V)
Gate - Charge Qg (nC)
Fig9. Safe Operation Area
(KHB8D8N25P)
102
Operation in this area is limited by RDS(ON)
Fig10. Safe Operation Area
(KHB8D8N25F, KHB8D8N25F2)
102
Operation in this area is limited by RDS(ON)
100 s 1ms 10 ms 100 ms
Drain Current ID (A)
Drain Current ID (A)
100s
101
101
10ms DC
1ms
100
DC
100
TC= 25 C Tj = 150 C Single nonrepetitive pulse
10-1
TC= 25 C Tj = 150 C Single nonrepetitive pulse
10-1
100
101
102
10-2 0 10
101
102
Drain - Source Voltage VDS (V)
Drain - Source Voltage VDS (V)
Fig11. ID - Tj
10 8 6 4 2 0 25 50 75 100 125 150
Drain Current ID (A)
Junction Temperature Tj ( C )
2007. 5. 10
Revision No : 0
4/7
KHB8D8N25P/F/F2
Fig12. Transient Thermal Response Curve
Normalized Transient Thermal Resistance
100
Duty=0.5
0.2
10-1
0.1
0.05
PDM t1 t2
Single Pulse
0.02
0.01
- Duty Factor, D= t1/t2 10-3 10-2 10-1 100 101
10-2 10-5 10-4
TIME (sec)
Fig13. Transient Thermal Response Curve
Normalized Transient Thermal Resistance
100
Duty=0.5
0.2
10-1
0.1
0.05
PDM t1 t2
0.02
0.01
10-2 10-5
Single Pulse
- Duty Factor, D= t1/t2 10-3 10-2 10-1 100 101
10-4
TIME (sec)
2007. 5. 10
Revision No : 0
5/7
KHB8D8N25P/F/F2
Fig14. Gate Charg
VGS 10 V ID Fast Recovery Diode
0.8 VDSS 1.0 mA
ID
VDS Qgs VGS Qgd Qg
Q
Fig15. Single Pulsed Avalanche Energy
EAS= 1 LIAS2 2
BVDSS BVDSS - VDD
BVDSS
L
IAS
0.5 VDSS
25 VDS ID(t)
VDD
10 V VGS
VDS(t)
Time tp
2007. 5. 10
Revision No : 0
6/7
KHB8D8N25P/F/F2
Fig16. Resistive Load Switching
VDS RL 0.5 VDSS 25 VGS 10% tf 10V td(on) VGS ton tr td(off) toff 90%
VDS
Fig17. Source - Drain Diode Reverse Recovery and dv /dt
Body Diode Forword Current DUT VDS IF
ISD (DUT)
IRM
di/dt
0.8 x VDSS
driver
IS VDS (DUT)
Body Diode Reverse Current
Body Diode Recovery dv/dt VSD
10V
VGS Body Diode Forword Voltage drop
VDD
2007. 5. 10
Revision No : 0
7/7


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